Home ProductsThermal Adhesive Tape

Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK

Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK
Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK

Large Image :  Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIA800FG
Payment & Shipping Terms:
Minimum Order Quantity: 10SQM
Packaging Details: 10RL/bag
Delivery Time: 2-3Work day
Supply Ability: 1000SQM/Day
Detailed Product Description
Recommend Using Pressure: 10 Psi Adhesive Type: Acrylic Adhesive
Backing Type: Glass Fiber Peel Adhesion: 1200 G/inch2
Thermal Conductivity: 0.8 W/mK Voltage Breakdown: > 3000 Vac
High Light:

adhesive foam tape

,

thermally conductive adhesive tape

Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes

 

 

The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

 

 


Features


>  Thermal Conductivity: 0.8 W/mK
>  High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
>  High performance, thermally conductive acrylic adhesive

 

Applications


>  Mount heat sink onto BGA graphic processor or drive processor
>  Mount heat spreader onto power converter PCB or onto motor control PCB
>  High performance, thermally conductive acrylic adhesive 
>  Can be used instead of heat cure adhesive,screw mounting or clip mounting

 

Typical Properties of TIA™800FG Series
Product Name TIATM805FG TIATM806FG TIATM808FG TIATM810FG TIATM815FG TIATM820FG  Test  Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Glass fiber ********

Composite

Thickness

0.005" 0.127mm 0.006" 0.152mm 0.020" 0.203mm 0.010" 0.254mm 0.015" 0.381mm 0.020" 0.508mm ASTM D374

Aluminum Foil

Thickness

±0.001"  ±0.025mm ±0.001"  ±0.025mm ±0.0012" ±0.03mm ±0.0012" ±0.03mm ±0.0015" ±0.038mm ±0.002"  ±0.05mm

ASTM D374

Voltage Breakdown > 2000 Vac > 2000 Vac > 2300 Vac > 3000 Vac > 3500 Vac > 3500 Vac ASTM D149
Peel Adhesion 1200 g/inch2 JIS K02378

Holding Power

25℃/Days

> 120 kg/inch2 JIS K023711
Holding Power 120℃/Hours > 10 kg/inch2 JIS K023711

Recommend

Using Pressure

10 psi ********
Thermal Conductivity 0.8 W/mK ********

Thermal

Impedance

@50psi

0.52℃-in²/W 0.59℃-in²/W 0.83℃-in²/W 0.91℃-in²/W 1.15℃-in²/W 1.43℃-in²/W ASTM D5470
 
Standard Thicknesses:      
     
0.005"(0.127mm)     0.006"(0.152mm)     0.008"(0.203mm)     0.010"(0.254mm)     0.015"(0.381mm)     0.020"(0.508mm)   
Consult the factory alternate thickness.

Standard Sizes: 

10" x 18"(254mm x 457mm)    10" x 400'(254mm x 121.9M) 
Individual die cut shapes can be supplied.

Reinforcement:     
                
TIA™800 Series sheets are fiberglass reinforced.
 
Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK 0

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)