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Blue Color Thermal Gap Filler , 3W / MK Silicone Gap Pad For Telecom Device

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Blue Color Thermal Gap Filler , 3W / MK Silicone Gap Pad For Telecom Device

Blue Color Thermal Gap Filler , 3W / MK Silicone Gap Pad For Telecom Device
Blue Color Thermal Gap Filler , 3W / MK Silicone Gap Pad For Telecom Device
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Large Image :  Blue Color Thermal Gap Filler , 3W / MK Silicone Gap Pad For Telecom Device

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL
Model Number: TIF 520S-FG
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
PRODUCT NAME: TIF520S-FG Keywords: Reinforced Thermal Gap Filler
Brand: Ziitek Voltage: >1500~>5500 VAC
Material: Silicone Thermal Pads
High Light:

thermally conductive filler

,

high temperature phase change materials

 

Blue Color Thermal Gap Filler , 3W / MK Silicone Gap Pad For Telecom Device

 

The TIF520S-FG  thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 


Features:

 

> Thickness: 0.5 mmT
> Good thermal conductive:W/mK
> Naturally tacky  
> Soft and Compressible for low stress applications
> Available in varies hardness

 

Applications:

 

> LED TV and LED-lit lamps
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF 520S-FG 
Color

BLUE

Visual Composite Thickness  hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

2.87 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
40
(Shore 00)
ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
4.0X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

Thermal conductivity
3 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
 
Standard Thicknesses:           
0.020" (0.5mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)  
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

 
Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
Blue Color Thermal Gap Filler , 3W / MK Silicone Gap Pad For Telecom Device 0
 

Company Profile:

 

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

FAQ:

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)