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2W/mK yellow Soft Silicone Thermally Conductive Putty Gap Filler 2.6 g/cc 200V/mil For Radiating Modules

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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2W/mK yellow Soft Silicone Thermally Conductive Putty Gap Filler 2.6 g/cc 200V/mil For Radiating Modules

2W/mK yellow Soft Silicone Thermally Conductive Putty Gap Filler  2.6 g/cc 200V/mil For Radiating Modules
2W/mK yellow Soft Silicone Thermally Conductive Putty Gap Filler  2.6 g/cc 200V/mil For Radiating Modules 2W/mK yellow Soft Silicone Thermally Conductive Putty Gap Filler  2.6 g/cc 200V/mil For Radiating Modules

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF020-19
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 600cc/tube
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Specific Gravity: 2.6g/cc Thermal Diffusivity: 1.070mm2/s
Fire Rating: 94-V0 Color: Yellow
Continuous Use Temp: -45-200 ℃ Good Thermal Conductive: 2 W/mK
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electrically conductive putty

2W/mK yellow Soft Silicone Thermally Conductive Putty Gap Filler 2.6 g/cc 200V/mil For Radiating Modules

 

TIF020-19 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF020-19 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF020-19 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF020-19 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

 

 

Application

 

>Heat-sink & frame

>LED backlight module,LED lighting

>High speed hardware driver

>Micro heat pipe ,Vihicel enginee controler

>Telecom industry

>wireless routers

>Chipset

> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

 

Feature

 

>Thermal conductivity: 2.0W/mK

>Soft, very low compression

>Operate automaticly

 

TIFTM020-19 Property
Color Yellow Visual
Construction & Composition Ceramic filled silicon material **********
Viscosity 4500,000cps GB/T 10247
Specific Gravity 2.6 g/cc ASTM D297
Thermal conductivity 2.0 W/mK ISO 22007-2
Thermal diffusivity 1.070 mm2/s ISO 22007-2
Specific heat capacity 2.2 MJ/m3K ISO 22007-2
Continuous Use Temperature -45 ~200°C ******
Dielectric breakdown strength 200 V/mil ASTM D149
Flame Rating 94V0 E331100
Outgassing,%TML 0.85% ASTM E595

 

 

Package :

 

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.

 

 

2W/mK yellow Soft Silicone Thermally Conductive Putty Gap Filler  2.6 g/cc 200V/mil For Radiating Modules 0

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: sales02

Tel: +8618153789196

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