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2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated
2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated 2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated 2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

Large Image :  2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF3160
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Application: PCB Board Heat Capacity: 1 L /g-K
Color: Gray Thickness: 4mmT
Hardness: 35 Shore 00
High Light:

thermally conductive filler

,

thermal conductivity silicone

2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

 

  The TIF3160 thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.


Features:

 

>  Perfect heat sinking 
>  Good thermal conductive:  2.8 W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Thcikness: 3mmT

 


Applications:

 

>  Automotive engine control units

> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps

> Micro heat pipe thermal solutions

>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment

> RDRAM memory modules

> Cooling components to the chassis of frame

 

 

Typical Properties of TIF™3160
Color

gray

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
*** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
2.41 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
27 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

40 psi

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
6.3X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V-0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
 2.8 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated 0

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)