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2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00

2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00
2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00 2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00 2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00 2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-20-07E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Thermal Conductivity& Compostion: 1.5 W/m-K Specific Gravity: 2.85 G/cc
Heat Capacity: 1 L /g-K Color: Green
Continuos Use Temp: -50 To 200℃
High Light:

thermally conductive filler

,

thermal conductivity silicone

2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00

 

 

  The TIF100-20-07E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 

2.0 W/mK Ultrasoft CPU Heatsink Pad , Green Thermal Silicone Pads TIF100-20-07E thermal gap filler 45 Shore 00 0


Features:


>  Good thermal conductive:2.0 W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF™100-20-07E Series
Color

Green

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
2.80 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
45 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 ps

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
>10000 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
7.5 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
8X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
2.0 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

 
Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

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