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13 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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13 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad

13 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad
13 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad
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Large Image :  13 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL RoHs
Model Number: TIF™7100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 100000pcs/day
Detailed Product Description
Thermal Conductivity: 13 W/mK Application: Wireless Router
Dielectric Breakdown Voltage: >5000 VAC Name: TIF7100
Feature: Ultra Soft Keywords: Thermal Gap Filler Pad
High Light:

thermally conductive filler

,

thermal conductivity silicone

 
13 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad
 
The TIF™ 7100  thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
>  Good thermal conductive: 13 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies size
>  Thickness: 2.5mmT
Applications:
>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 
Typical Properties of TIF™ 7100
Color
Gray VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm

0.57

20mils / 0.508 mm

0.71

Specific Gravity

3.14 g/cc

ASTM D297

30mils / 0.762 mm

0.88

40mils / 1.016 mm

0.96

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.11

60mils / 1.524 mm

1.26

Hardness
45 Shore 00ASTM 2240

70mils / 1.778 mm

1.39 

80mils / 2.032 mm

1.54 

Tensile Strength  

48 psi

ASTM D412

90mils / 2.286 mm

1.66 

100mils / 2.540 mm

1.78

Continuos Use Temp
-40 to 200℃

***

110mils / 2.794 mm

1.87   

120mils / 3.048 mm

1.99   

Dielectric Breakdown Voltage>10000 VACASTM D149

130mils / 3.302mm

2.12

140mils / 3.556 mm

2.22

Dielectric Constant
10.2 MHzASTM D150

150mils / 3.810 mm

2.31

160mils / 4.064 mm

2.41

Volume Resistivity6.2X10¹³
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.51

180mils / 4.572 mm

2.58

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.64 

200mils / 5.080 mm

2.72

Thermal conductivity
 13 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
 
Standard Thicknesses:          
 
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:     
    
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 
 

Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:    
           
TIF™ series sheets type can add with fiberglass reinforced.
 
13 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad 0
 

Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
 
FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

 

Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)