The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
—— Chris Rogers
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LED Heat Sink Aluminum Foil Thermal Adhesive Tape with High Thermal Conductivity 1.6 W /mK
Heat Sink Thermal Conductive Adhesive Tape , 0.8 W / mK Glass Fiber Backing Heat Resistant Tape The TIA™815 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
-50 - 180℃ Continuous Use Temp Acrylic Adhesive Tape with Ceramic Filled Silicone Elastomer The TIA™808 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
0.304mm Thickness IGBT Heatsink Blue Thermal Adhesive Tape with Glass Fiber Backing Acrylic The TIA™812 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
Non Toxic Heatsink Cooling Thermally Conductive Adhesive Transfer Tape with 0.1mm / 0.5mm Thickness The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
Strong Viscosity Thermal Adhesive Tape , White Adhesive Tape for LED Aluminum Plate Heat Dissipation The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
1.2 W / mK High Performance Thermal Conductive Adhesive For Led Fluorescent Lamp The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption ... Read More
Glass Fiber Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA™808FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
LED Lamp Heat Resistant Adhesive Thermal Conductive with Ceramic Filled Silicone Elastomer The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Read More
Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Read More
Heat Sink Thermal Conductive Acrylic Based Adhesive High Bond Strength 10" x 18" Size The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption ... Read More
