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Ceramic Filled Silicone Elastomer Thermal Conductive Adhesive , Thickness 0.1~0.5mmT

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Good quality Thermal Conductive Pad for sales
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Ceramic Filled Silicone Elastomer Thermal Conductive Adhesive , Thickness 0.1~0.5mmT

China Ceramic Filled Silicone Elastomer Thermal Conductive Adhesive , Thickness 0.1~0.5mmT supplier
Ceramic Filled Silicone Elastomer Thermal Conductive Adhesive , Thickness 0.1~0.5mmT supplier Ceramic Filled Silicone Elastomer Thermal Conductive Adhesive , Thickness 0.1~0.5mmT supplier Ceramic Filled Silicone Elastomer Thermal Conductive Adhesive , Thickness 0.1~0.5mmT supplier Ceramic Filled Silicone Elastomer Thermal Conductive Adhesive , Thickness 0.1~0.5mmT supplier Ceramic Filled Silicone Elastomer Thermal Conductive Adhesive , Thickness 0.1~0.5mmT supplier

Large Image :  Ceramic Filled Silicone Elastomer Thermal Conductive Adhesive , Thickness 0.1~0.5mmT

Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIA808FG Replace Bergquist Bond-Ply 100

Payment & Shipping Terms:

Minimum Order Quantity: 10SQM
Packaging Details: 10RL/bag
Delivery Time: 2-3Work day
Supply Ability: 1000SQM/Day
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Detailed Product Description
Thickness: 0.1~0.5mmT Color: White
Construction &Compostion: Ceramic Filled Silicone Elastomer Peel Adhesion: 1200 G/inch2
Thermal Conductivity: 1.2 W/mK Hardness: 50 Shore A

Mount heat sink onto BGA graphic processor or drive processor Thermal Conductive Adhesive For Led Fluorescent Lamp Replace Bergquist Bond-Ply 100

 
 The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
 

Features

> Thermal Conductivity: 1.2 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive

Applications

> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive 
> Can be used instead of heat cure adhesive,screw mounting or clip mounting
 
Typical Properties of TIA™800FG Series
Product Name TIATM805FG TIATM806FG TIATM808FG TIATM810FG TIATM815FG TIATM820FG  Test  Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Glass fiber ********
Composite Thickness 0.005" 0.127mm 0.006" 0.152mm 0.020" 0.203mm 0.010" 0.254mm 0.015" 0.381mm 0.020" 0.508mm ASTM D374
Glass fiber Thickness ±0.001"  ±0.025mm ±0.001"  ±0.025mm ±0.0012" ±0.03mm ±0.0012" ±0.03mm ±0.0015" ±0.038mm ±0.002"  ±0.05mm

ASTM D374

Voltage Breakdown > 2000 Vac > 2000 Vac > 2300 Vac > 3000 Vac > 3500 Vac > 3500 Vac ASTM D149
Peel Adhesion 1200 g/inch2 JIS K02378

Holding Power

25℃/Days

> 120 kg/inch2 JIS K023711
Holding Power 120℃/Hours > 10 kg/inch2 JIS K023711
Recommend Using Pressure 10 psi ********
Thermal Conductivity 1.2W/mK ********

Thermal

Impedance@50psi

0.52℃-in²/W 0.59℃-in²/W 0.83℃-in²/W 0.91℃-in²/W 1.15℃-in²/W 1.43℃-in²/W ASTM D5470
 
 
Standard Thicknesses:      
     
0.005"(0.127mm)     0.006"(0.152mm)     0.008"(0.203mm)     0.010"(0.254mm)     0.015"(0.381mm)     0.020"(0.508mm)   
Consult the factory alternate thickness.

Standard Sizes: 

10" x 18"(254mm x 457mm)    10" x 400'(254mm x 121.9M) 
Individual die cut shapes can be supplied.

Reinforcement:     
                
TIA™800 Series sheets are fiberglass reinforced.
Ceramic Filled Silicone Elastomer Thermal Conductive Adhesive , Thickness 0.1~0.5mmT

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

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