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Garnet silicone Thermal gap filler Heatsink Thermal Pad 6.0 W/MK

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Garnet silicone Thermal gap filler Heatsink Thermal Pad 6.0 W/MK

Garnet silicone Thermal gap filler Heatsink Thermal Pad  6.0 W/MK
Garnet silicone Thermal gap filler Heatsink Thermal Pad  6.0 W/MK
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Large Image :  Garnet silicone Thermal gap filler Heatsink Thermal Pad 6.0 W/MK

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: Replace Fujipoly GR-M
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Thermal Conductivity& Compostion: 6.0 W/m-K Specific Gravity: 2.95 G/cc
Heat Capacity: 1 L /g-K Color: Garnet
Continuos Use Temp: -50 To 200℃ Hardness: 52 Shore 00
High Light:

thermally conductive filler

,

high temperature phase change materials

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Garnet silicone Thermal gap filler

Garnet silicone Thermal gap filler Heatsink Thermal Pad 6.0 W/MK

 

The TIF600P Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 


Features:


>  Good thermal conductive:6.0 W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  CD-Rom, DVD-Rom cooling

 

Typical Properties of TIF™600P Series
Color

Garnet

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
2.95 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
52 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 ps

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
>10000 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
7.5 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
8X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
6 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

Garnet silicone Thermal gap filler Heatsink Thermal Pad  6.0 W/MK 0
 

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

TIF600P Series Datasheet-(E)-REV01.pdf

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

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