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Power transformers Thermal Conductive Epoxy Glue , 1.5 g / cc Specific Gravity

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Power transformers Thermal Conductive Epoxy Glue , 1.5 g / cc Specific Gravity

Power transformers Thermal Conductive Epoxy Glue , 1.5 g / cc Specific Gravity
Power transformers Thermal Conductive Epoxy Glue , 1.5 g / cc Specific Gravity Power transformers Thermal Conductive Epoxy Glue , 1.5 g / cc Specific Gravity Power transformers Thermal Conductive Epoxy Glue , 1.5 g / cc Specific Gravity Power transformers Thermal Conductive Epoxy Glue , 1.5 g / cc Specific Gravity

Large Image :  Power transformers Thermal Conductive Epoxy Glue , 1.5 g / cc Specific Gravity

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIS680-15A/B
Payment & Shipping Terms:
Minimum Order Quantity: 2kg/LOT
Packaging Details: 1kg/can
Delivery Time: 2-3 work day
Supply Ability: 1000KG
Detailed Product Description
Color: White Viscosity@25℃ Brookfield: 4,000 CPs
Specific Gravity: 1.5 G/cc Shelf Life @25℃ In Sealed Container: 12 Months
Hardness @25℃: 85 Shore D Fire Resistance UL: 94-V0
High Light:

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Thermal Conductive Glue 1.5 g / cc

Power transformers Thermal Conductive Glue , 1.5 g / cc Specific Gravity Heat Conductive Epoxy Glue

 

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
 
  TIS™ 680-15AB is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. It is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
 
Features
 
>  Good thermal conductive: 1.5W/mK
>  Excellent insulation and smoothly sourface.
>  Low shrinkage
>  Low viscosity, expediting air releaseed.
>  Excellent in solvents and water proof. 
>  Longer life time.
>  Excellent thermal shock efficiecy and impact resistance

 
Application  
 
>  To potting LED Lighting heat spreader and  power- driver.
>  Ferrite cements; tip type LED; good cementation to aromatic polyester 
>  Relay sealant; Good adhesion to rubber, ceramics,  PCB and plastics 
>  Power transformers and coils; Potting capacitors;  Potting of small electrical devices 
>  Adhesion to metal glass and plastic; LCD & substrates adhesion; Coating and sealant;  Coil ; IGBTS;          Transformer; Fire retardant 
>  Optical / medical component adhesive

Typical Uncured Material   TIS™ 680-15A (Resin)  
Color  White
Viscosity@25℃ Brookfield  4,000 cPs 
Specific Gravity  1.5 g/cc
Shelf life @25℃ in sealed container  12 months 

 

TIS™ 680-10B (Hardener)
Color  White
Viscosity@25℃ Brookfield  4,000 cPs 
Shelf life @25℃ in sealed container  12 months

 

                                                                                                      Mix Ratio (By weight) 
TIS™ 680-10A : TIS™ 680-10B = 100 : 100  
Viscosity @25℃ 4,000 cPs
Working pot life (250 g @25℃)  30 min
Specific Gravity  1.5 g/ccn 

 

Cure Schedule  
Cure 3 hours at 25℃
Cure 20 min at 70℃

 

Cured Properties 
Hardness @25℃ 85 Shore D 
Service temperature -40℃ to +160℃
Glass transition temperature Tg   92℃
Elongation 4.50%
Coefficient of thermal expansion, / ℃ 3.0 x 10-5
Fire resistance UL 94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃ < 0.1
Thermal
Thermal Impedance @10psi 0.36℃-in²/W
ELECTRICAL AS CURED
Dielectric Strength 400 volts / mil 
Dielectric Constant 4.2 MHz 
Dissipation factor 0.029 MHz 
Volume resistivity, ohm-cm @ 25℃ 3.0 X 1013

 

Power transformers Thermal Conductive Epoxy Glue , 1.5 g / cc Specific Gravity 0

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

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