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IGBTs Low Thermal Resistance Phase Change Material 0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK

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IGBTs Low Thermal Resistance Phase Change Material 0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK

China IGBTs Low Thermal Resistance Phase Change Material  0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK supplier
IGBTs Low Thermal Resistance Phase Change Material  0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK supplier IGBTs Low Thermal Resistance Phase Change Material  0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK supplier IGBTs Low Thermal Resistance Phase Change Material  0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK supplier

Large Image :  IGBTs Low Thermal Resistance Phase Change Material 0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK

Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC™800Y

Payment & Shipping Terms:

Minimum Order Quantity: 1000PCS
Price: negotiation
Packaging Details: 1000pcs/bay
Delivery Time: 3-5days
Payment Terms: T/T
Supply Ability: 100000pcs/day
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Detailed Product Description
Product Name: Phase Changing Materials Color: Yellow
Thermal Conductivity: 0.95 W/mK Phase Transition Temperature: 50℃~60℃
Thickness: 0.127mm~0.25mmT Density: 2.2g/cc
Setting Temperature: 70℃ For 5 Minutes

IGBTs Phase Change Material Heat Sink 0.024℃-in² / W With Low Thermal Resistance

 

  The TIC™800Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

 

     The TIC™800Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 


Features:


>  0.024℃-in² /W thermal resistance
>  Naturally tacky at room temperature, no adhesive required             
>  No heat sink preheating required 


Applications:


>  High Frequency Microprocessors
>  Notebook and Desktop PCs
>  Computer Serves
>  Memory Modules
>  Cache Chips
>  IGBTs

>  Telecommunication 

 

Typical Properties of TIC™800Y Series
Product Name
TICTM803Y
TICTM805Y
TICTM808Y
TICTM810Y
Testing standards
Color
Yellow
Yellow
Yellow
Yellow
Visual
Composite Thickness

 

0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density
2.2g/cc
  Helium  Pycnometer
Work temperature
-25℃~125℃
 
phase transition  temperature
50℃~60℃
 
Setting temperature
70℃ for 5 minutes
 
Thermal conductivity
0.95 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)
0.021℃-in²/W
0.024℃-in²/W
0.053℃-in²/W
0.080℃-in²/W
ASTM D5470 (modified)
0.14℃-cm²/W
0.15℃-cm²/W
0.34℃-cm²/W
0.52℃-cm²/W
 
Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)              
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement: 

No reinforcement is necessary.
 
IGBTs Low Thermal Resistance Phase Change Material  0.024℃-in² / W No heat sink preheating required TIC™800Y 0.95 W/mK

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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