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2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated
2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated 2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated 2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

Large Image :  2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF3160
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Application: PCB Board Heat Capacity: 1 L /g-K
Color: Gray Thickness: 4mmT
Hardness: 35 Shore 00
High Light:

thermally conductive filler

,

thermal conductivity silicone

,

2.8W / MK Thermal Gap Filler

2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

 

  The TIF3160 thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.


Features:

 

>  Perfect heat sinking 
>  Good thermal conductive:  2.8 W/mK 

>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Thcikness: 3mmT

 


Applications:

 

>  Automotive engine control units

> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps

> Micro heat pipe thermal solutions

>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment

> RDRAM memory modules

> Cooling components to the chassis of frame

 

 

Typical Properties of TIF™3160
Color

gray

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
*** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
2.41 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
27 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

40 psi

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.00 

120mils / 3.048 mm

1.07 
Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
6.3X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V-0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
 2.8 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated 0

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)