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|Color:||Dark Grey||Thermal Conductivity:||2 W/mK|
|Product Name:||Zpaster140-20-11S||Specific Gravity:||2.65 G/cc|
|Dielectric Constant:||5.5 MHz||Outgassing (TML):||0.30%|
No silicone material thermal gap pad Zpaster140-20-11S 2w silicone-free thermal pad 2.65 g/cc 1mmT for battery
Zpaster140-20-11S is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.
It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
>Good thermal conductive:2.0 W/mK
>Soft and Compressible for low stress applications
>Available in varies thickness
>Car Battery & Power Supply
>Graphics Card Thermal Module
>Set Top Box
> Medical devices
>SFP optical module
|Typical Properties of Z-Paster140-20-11S Series|
|Color||Dark grey||Visual||Dielectric Breakdown Voltage (T= 1mm above)||>5000 VAC||ASTM D149|
|Construction||Silicone-free The metal oxide fills||**********||Dielectric Constant||5.5 MHz||ASTM D150|
|Thermal Conductivity||2.0 W/mK||ASTM D5470||Volume Resistivity||6.0X1013 Ohm-meter||ASTM D257|
|Hardness||50 Shore 00||ASTM 2240||Continuous Use Temp||– 20 To 125 ℃||**********|
|Specific Gravity||2.65 g/cc||ASTM D297||Outgassing (TML)||0.30%||ASTM E595|
|Thickness range||0.010"-0.200" (0.25mm-5.0mm)||ASTM D374||Flame Rating||94 V0||equivalent to|
0.010-inch to 0.200-inch (0.25mm to 5.0mm)
Proprietary NS1 option available to eliminate tack from one side to aid in handling.