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High Quality Silicone Materials 27shore00 1.75mmT Thermal Gap Pad TIF170-30-49U For Cooling PCB And LED

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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High Quality Silicone Materials 27shore00 1.75mmT Thermal Gap Pad TIF170-30-49U For Cooling PCB And LED

High Quality Silicone Materials 27shore00 1.75mmT Thermal Gap Pad TIF170-30-49U For Cooling PCB And LED
High Quality Silicone Materials 27shore00 1.75mmT Thermal Gap Pad TIF170-30-49U For Cooling PCB And LED High Quality Silicone Materials 27shore00 1.75mmT Thermal Gap Pad TIF170-30-49U For Cooling PCB And LED

Large Image :  High Quality Silicone Materials 27shore00 1.75mmT Thermal Gap Pad TIF170-30-49U For Cooling PCB And LED

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF170-30-49U
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Hardness: 27 Shore 00 Thickness: 1.75mmT
Dielectric Breakdown Voltage: >10000 VAC Fire Rating: 94-V0
Color: Pink Tensile Strength: TIF170-30-49U
Good Thermal Conductive: 3 W/mK
High Light:

Pink Thermal Gap Pad

,

1.75mm Thermal Gap Pad

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27 Shore 00 Thermal Gap Pad

High quality silicone materials 27shore00 1.75mmT thermal gap pad TIF170-30-49U for cooling PCB and LED

 

  The TIF170-30-49U is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 


Features:


>  Good thermal conductive: 3 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 
Typical Properties of TIF170-30-49U 
Color

Pink

Visual Composite Thickness  hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

2.10 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
27 SHORE00 ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
4.0X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

Thermal conductivity
3 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
 
Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 
 

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

High Quality Silicone Materials 27shore00 1.75mmT Thermal Gap Pad TIF170-30-49U For Cooling PCB And LED 0

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

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