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Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials

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Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials

China Cache Chips gray 2.5 W/mK  No heat sink preheating required phase changing materials supplier
Cache Chips gray 2.5 W/mK  No heat sink preheating required phase changing materials supplier Cache Chips gray 2.5 W/mK  No heat sink preheating required phase changing materials supplier Cache Chips gray 2.5 W/mK  No heat sink preheating required phase changing materials supplier Cache Chips gray 2.5 W/mK  No heat sink preheating required phase changing materials supplier

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Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC™808A

Payment & Shipping Terms:

Minimum Order Quantity: 1000PCS
Price: negotiation
Packaging Details: 1000pcs/bay
Delivery Time: 3-5days
Payment Terms: T/T
Supply Ability: 100000pcs/day
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Detailed Product Description
Product Name: Phase Changing Materials Color: Gray
Thermal Conductivity: 2.5 W/mK Phase Transition Temperature: 50℃~60℃
Density: 2.5g/cc Work Temperature: -25℃~125℃

Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials

 

 

  The TIC™808A is low melting point thermal interface material. At 50℃, The TIC™808A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™808A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. 


      The TIC™808A  shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 

 


Features:


> 0.018℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required             
> No heat sink preheating required 


Applications:


> High Frequency Microprocessors

> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

 

Typical Properties of TIC™800A Series
Product Name
TICTM803A
TICTM805A
TICTM808A
TICTM810A
Testing standards
Color
Ashy
Ashy
Ashy
Ashy
Visual
Composite Thickness
0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density
2.5g/cc
  Helium   Pycnometer
Work Temperature
-25℃~125℃
 
phase transition  temperature
50℃~60℃
 
Setting temperature
70℃ for 5 minutes
 
Thermal conductivity
2.5 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa)
0.018℃-in²/W
0.020℃-in²/W
0.047℃-in²/W
0.072℃-in²/W
ASTM D5470 (modified)
0.11℃-cm²/W
0.13℃-cm²/W
0.30℃-cm²/W
0.46℃-cm²/W
 
Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)            
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement: 

No reinforcement is necessary.
 
Cache Chips gray 2.5 W/mK  No heat sink preheating required phase changing materials

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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